Samsung Galaxy S26 deals with heat problems thanks to this clever piece of metal
In a few weeks, Samsung will unveil the new Galaxy S26 series. These new smartphones promise to be much more powerful thanks to the brand new Exynos 2600 chip. The secret? A small piece of metal that Samsung has cleverly applied.
Your phone processor has gotten much smaller over the years. In addition to smaller, it has become faster. Much faster! And that combination creates more heat. Smartphone manufacturers are becoming more and more innovative to dissipate this heat. Vapor chambers, liquid cooling and even fans have come along. Samsung has come up with something new.
.Samsung builds the heatsink on the Exynos 2600 directly into the chip itself. This Heat Pass Block (HPB) ensures that the future Samsung Galaxy S26 and S26+ together will soon stay 16% cooler. This will keep your S26 running buttery smooth even during heavy games like Genshin Impact or Call of Duty, without your phone getting blisteringly hot in your hands.
Competition looks jealously at Samsung's cooling
The idea of building a heatsink into the chip has not gone unnoticed by others. Competitors to Qualcomm and MediaTek are also said to be interested in applying it. It remains to be seen if Qualcomm applies this in its upcoming Snapdragon 8 Gen 6 chip. If not, I think Samsung has finally closed the gap between the Exynos and Snapdragon.
Samsung will announce the Galaxy S26 Series on Feb. 25, according to the latest rumors. The devices will then be in stores on March 11.
